초음파 신호분석을 이용한 접착접합 이음의 결함평가

초록

Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And, ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of Al6061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.

키워드