Copper superfilling of carbon nanotube assembly with long-tortuous pore via one-step electroplating

초록

Carbon nanotube-copper (CNT-Cu) composites have attracted considerable attention as lightweight conductors owing to their superior properties. Copper electroplating in aqueous electrolyte with additives is generally preferred for Cu-superfilling of simple structures due to its practicality, compatibility and eco-friendly approach. While these additives are effective on simple structures like trenches, their efficiency in filling complex and longtortuous pores remains uncertain. In this study, a superfilled CNT-Cu conductor is fabricated through a one-step electroplating process, employing a bottom-up filling mechanism aided by additives in an aqueous electrolyte. CNT-Cu conductor exhibits 1.6 times higher specific ampacity and lower density compared to Cu, making it an excellent choice for lightweight conductors. Furthermore, the CNT-Cu composite offers superior surface hardness and enhanced corrosion resistance, positioning it as a strong contender for practical applications. A comprehensive analysis of the skin effect of the CNT-Cu composite conductor at high frequencies has been conducted for potential future applications.

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