Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process

  • Lee, Changhyun; 
  • Park, Jonghoon; 
  • Yoo, Jinho; 
  • Cho, Hyungjun; 
  • Choi, Jungi; 
  • ... Park, Changkun; 
  • 외 1명
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초록

A wireless type of chip-to-chip communication (WCC) technology is proposed as the next generation of 3D semiconductor technology. To demonstrate the feasibility of this technology, we designed a coil, transmitter and receiver for wireless chip-to-chip communication using a 50-nm digital CMOS process. The coil is designed using inductive coupling with design parameters that include the number of turns, the metal width, and the space between adjacent metal lines. A differential transceiver structure is proposed for the WCC technology. The transmitter of the transceiver acts as a termination and bias circuit for the receiver while the transceiver is operating as a receiver. The receiver is designed with a typical differential amplifier and a latch to recover the transmitted original digital signal. The proposed transceiver and coil for the proposed WCC technology is implemented using commercial 50-nm digital CMOS technology. Experimental results successfully demonstrate the feasibility of the WCC technology. (C) 2013 The Authors. Published by Elsevier Ltd. All rights reserved.

키워드

3D semiconductor; Coil; LATCH; Wireless communication; POWER-AMPLIFIER; ENERGY-TRANSFER
제목
Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process
저자
Lee, Changhyun; Park, Jonghoon; Yoo, Jinho; Cho, Hyungjun; Choi, Jungi; Cho, Jeongho; Park, Changkun
DOI
10.1016/j.mejo.2013.07.006
발행일
2013-09
유형
Article
저널명
Microelectronics Journal
권
44
호
9
페이지
852 ~ 859