Enhancing vertical thermal conductivity of carbon fiber reinforced polymer composites using cauliflower-shaped copper particles

  • Shin, G.J.; 
  • Kim, D.H.; 
  • Kim, J.-W.; 
  • Kim, S.H.; 
  • Lee, J.H.
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초록

Carbon fiber reinforced polymer (CFRP) composites are lightweight and mechanically robust, and therefore have received considerable attention with a wide range of applications from the aerospace to automotive industries. However, their low vertical thermal conductivity seriously limits the potential applicability of high-performance CFRPs in metal replacement. Herein, we propose a simple and effective, scalable strategy to fabricate thermally conductive and mechanically robust CFRP composites on the basis of formation of vertical heat transfer pathways using pressure-assisted thermal migration of cauliflower-shaped dendritic copper particles. A new type of CFRP composite was achieved by facile layer-by-layer coating of prepregs with dendritic coppers and subsequent pressure-assisted thermal processing under elevated temperature. The cauliflower-shaped dendritic copper particles efficiently infiltrated into the CFRP matrix and thereby provided an effective heat transfer pathway, resulting in a CFRP composite with an excellent vertical thermal conductivity of 2.321 W m−1 K−1, which is 155% higher than that of pristine CFRP. Moreover, the proposed CFRP composite afforded a high thermal diffusivity of 1.125 × 10−6 m2 s−1 and a low specific heat capacity of 1.267 J g−1 K−1, as well as an excellent flexural strength of about 2.4 GPa. © 2023 Elsevier Ltd

키워드

Carbon fiber reinforced polymer composite; Cauliflower-shaped copper; Layer-by-layer coating; Mechanical property; Vertical thermal conductivity; MECHANICAL-PROPERTIES; ELECTRICAL-CONDUCTIVITY; RESIN COMPOSITES; EPOXY MATRIX; NANOTUBES; ENHANCEMENT; FILLER; GRAPHITE; NANOCOMPOSITES; TOUGHNESS
제목
Enhancing vertical thermal conductivity of carbon fiber reinforced polymer composites using cauliflower-shaped copper particles
저자
Shin, G.J.; Kim, D.H.; Kim, J.-W.; Kim, S.H.; Lee, J.H.
DOI
10.1016/j.mtcomm.2023.105792
발행일
2023-06
유형
Article
저널명
Materials Today Communications
권
35