상세 보기
Optimization of multichip bonding on a SiOB platform for bidirectional optical subassembly using design of experiment
- Lim, J.W.;
- Hwang, S.H.;
- Lee, W.-J.;
- Kim, M.J.;
- Kim, S.H.;
- ... Kim, B.-G.;
- 외 3명
초록
We propose an assembly technique with optimum condition capable of performing high density multichip integration on a silicon optical bench platform using the design of experiment. We integrated the eight chips on a platform for 4 channels arrayed optical subassembly above 2.5Gb/s/ch.
- 제목
- Optimization of multichip bonding on a SiOB platform for bidirectional optical subassembly using design of experiment
- 저자
- Lim, J.W.; Hwang, S.H.; Lee, W.-J.; Kim, M.J.; Kim, S.H.; Hann, S.; Kim, J.-S.; Kim, B.-G.; Rho, B.S.
- 발행일
- 2010
- 학회명
- 15th OptoElectronics and Communications Conference, OECC2010
- 개최지
- Sapporo
- 학회 개최일
- 2010-07-05 ~ 2010-07-09