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Electrical Characterization of the Through Via in Package-on Package with Interposer using Parameter Extraction Method
- 제목
- Electrical Characterization of the Through Via in Package-on Package with Interposer using Parameter Extraction Method
- 저자
- 김부균
- 발행일
- 2011-01
- 학회명
- The Second International Conference on Smart IT Applications
- 개최국가
- 캐나다
- 언어
- ENG