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경계요소법을 이용한 반도체 패키지의 응력특이성 해석
Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element method
- 박철희;
- 정남용
초록
Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(Γi) and stress intensity factors(Ki) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).
키워드
Large Scale Integration(LSI); Bonded Interface Edge(접합계면단); Thermal Stress(열응력); Delamination(층간박리); Stress Singularity Factor(응력특이성계수); Stress Intensity Factor(응력세기계수); Boundary Element Method(경계요소법).; Large Scale Integration(LSI); Bonded Interface Edge(접합계면단); Thermal Stress(열응력); Delamination(층간박리); Stress Singularity Factor(응력특이성계수); Stress Intensity Factor(응력세기계수); Boundary Element Method(경계요소법).
- 제목
- 경계요소법을 이용한 반도체 패키지의 응력특이성 해석
- 제목 (타언어)
- Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element method
- 저자
- 박철희; 정남용
- 발행일
- 2007-12
- 저널명
- 한국생산제조학회지
- 권
- 16
- 호
- 6
- 페이지
- 94 ~ 102