Hybrid integrated optical subassembly module using a polymeric wavelength division multiplexing filter based on multimode interference for 1.31-and 1.55-mu m bidirectional operation

  • Lim, Jung Woon; 
  • Hwang, Sung Hwan; 
  • Lee, Woo-Jin; 
  • Lee, Tae Ho; 
  • Jeong, Myung Yong; 
  • ... Kim, Boo-Gyoun; 
  • 외 1명
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초록

We present a new configuration for a polymer wavelength division multiplexing (WDM) filter based on multimode interference. We developed a hybrid integrated subassembly module for 1.31- and 1.55-mu m bidirectional operation. Active devices including a laser diode with a monitoring photodiode and a receiving photodiode were integrated on a silicon optical bench (SiOB) platform using a flip-chip bonding technique. A polymer WDM filter chip made of polymethylmethacrylate was fabricated using a hot embossing technique. We then investigated the optical performance of the transmitter and receiver subassembly module using a SiOB platform. This hybrid integrated subassembly module exhibited bidirectional 2.5-Gbit/s signal modulation with a minimum sensitivity of -20.5 dBm at a bit error rate of 10(-10) and an optical crosstalk of -35 dB. (C) 2010 Society of Photo-Optical Instrumentation Engineers. [DOI: 10.1117/1.3454385]

키워드

wavelength division multiplexing; multimode interference; hybrid integrated subassembly module; hot embossing technique; flip-chip bonding technique; PLANAR LIGHTWAVE CIRCUIT; FABRICATION; WDM
제목
Hybrid integrated optical subassembly module using a polymeric wavelength division multiplexing filter based on multimode interference for 1.31-and 1.55-mu m bidirectional operation
저자
Lim, Jung Woon; Hwang, Sung Hwan; Lee, Woo-Jin; Lee, Tae Ho; Jeong, Myung Yong; Kim, Boo-Gyoun; Rho, Byung Sup
DOI
10.1117/1.3454385
발행일
2010-06
유형
Article
저널명
Optical Engineering
권
49
호
6